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PCB mkpụrụ ọla kọpa maka ọkụ n'èzí
Otu osisi oyi akwa, ọkpụrụkpụ osisi:2.0mm;
Ọkpụkpụ ọla kọpa emechara: 35um,
Emecha: ENIG
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5.0W/MK High Thermal Conductivity MCPCB Maka ìhè odida obodo
Ụdị ígwè: Aluminom base
Ọnụọgụ nke akwa akwa: 1
Elu:ENIG
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8.0W / mk elu thermal conductivity MCPCB maka ọkụ eletrik
Ụdị ígwè: Aluminom base
Ọnụọgụ nke akwa akwa: 1
Elu: HaSL efu efu
Ọkpụrụkpụ efere: 1.5mm
ọkpụrụkpụ ọla kọpa: 35um
Nrụpụta okpomọkụ: 8W/mk
Nguzogide okpomọkụ: 0.015 ℃ / W
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FPC dị mkpa polyimide bendable nwere FR4 stiffener
Ụdị ihe: polyimide
Ọnụọgụ oyi akwa: 2
Obosara / oghere: 4 mil
Nha oghere min: 0.20mm
Ọkpụrụkpụ osisi emechara: 0.30mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: uhie
Ogologo oge: 10 ụbọchị
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6 oyi akwa impedance akara isiike-flex bọọdụ nwere stiffener
Ụdị ihe: FR-4, polyimide
Obosara / oghere: 4 mil
Obere oghere: 0.15mm
Ọkpụrụkpụ osisi emechara: 1.6mm
ọkpụrụkpụ FPC: 0.25mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: uhie
Ogologo oge: 20 ụbọchị
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Resin plugging oghere Microvia immersion silver HDI nwere mkpọpu laser
Ụdị ihe: FR4
Ọnụọgụ oyi akwa: 4
Obosara / oghere: 4 mil
Nha oghere min: 0.10mm
Ọkpụrụkpụ osisi emechara: 1.60mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: acha anụnụ anụnụ
Ogologo oge: 15 ụbọchị
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3 oz solder mask plugging ENEPIG bọọdụ ọla kọpa dị arọ
A na-eji PCB ọla kọpa dị arọ eme ihe na igwe eletrọnịkị na sistemu ike na-enye ike ebe enwere nnukwu ihe achọrọ ugbu a ma ọ bụ ohere nke ịgbapụ ngwa ngwa nke mmejọ ugbu a. Ibu ọla kọpa na-abawanye nwere ike gbanwee bọọdụ PCB na-adịghị ike ka ọ bụrụ ebe siri ike, ntụkwasị obi, na nke na-adịte aka na ikpo okwu wiring ma na-agbagha mkpa maka ihe mgbakwunye dị ọnụ ahịa na nnukwu ihe dị ka Heat sinks, fan, wdg.
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ngwa ngwa multilayer High Tg Board nwere ọla edo imikpu maka modem
Ụdị ihe: FR4 Tg170
Ọnụọgụ oyi akwa: 4
Obosara / oghere: 6 mil
Nha oghere min: 0.30mm
Ọkpụrụkpụ osisi emechara: 2.0mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: akwụkwọ ndụ akwụkwọ ndụ"
Ogologo oge: 12 ụbọchị
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otu akụkụ imikpu ọla edo seramiiki dabere
Ụdị ihe: seramiiki base
Ọnụọgụ oyi akwa: 1
Obosara / oghere: 6 mil
Nha oghere min: 1.6mm
Ọkpụrụkpụ osisi emechara: 1.00mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: acha anụnụ anụnụ
Ogologo oge: 13 ụbọchị
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Mgbakọ PCB SMT ahụike dị ala
SMT bụ mkpirisi maka teknụzụ dị n'elu, teknụzụ na usoro kachasị ewu ewu na ụlọ ọrụ mgbakọ eletrọnịkị. Eletrọnịkị sekit Surface Mount Technology (SMT) ka a na-akpọ Surface Mount ma ọ bụ Surface Mount Technology. Ọ bụ ụdị teknụzụ mgbakọ sekit nke na-etinye ihe mgbako na-enweghị isi ma ọ bụ mkpụmkpụ ndu elu (SMC / SMD na Chinese) n'elu ebe a na-ebi akwụkwọ Circuit (PCB) ma ọ bụ elu ala ndị ọzọ, wee weld na-ezukọta site na ịgbado ọkụ ma ọ bụ ịgbado ọkụ. itinye ịgbado ọkụ.
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ngwa ngwa ntụgharị ihe atụ gold plating PCB nwere Counter sink oghere
Ụdị ihe: FR4
Ọnụọgụ oyi akwa: 4
Obosara / oghere: 6 mil
Nha oghere min: 0.30mm
Ọkpụrụkpụ osisi emechara: 1.20mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: akwụkwọ ndụ akwụkwọ ndụ"
Ogologo oge: 3-4 ụbọchị
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1.6mm ngwa ngwa prototype ọkọlọtọ FR4 PCB
Ụdị ihe: FR-4
Ọnụọgụ oyi akwa: 2
Obosara / oghere: 6 mil
Obere oghere: 0.40mm
Ọkpụrụkpụ bọọdụ emechara: 1.2mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
N'ikpeazụ: duru HASL efu
Agba nkpuchi solder: akwụkwọ ndụ akwụkwọ ndụ
Ogologo oge: 8 ụbọchị