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PCB mkpụrụ ọla kọpa maka ọkụ n'èzí
Otu osisi oyi akwa, ọkpụrụkpụ osisi:2.0mm;
Ọkpụkpụ ọla kọpa emechara: 35um,
Emecha: ENIG
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5.0W/MK High Thermal Conductivity MCPCB Maka ìhè odida obodo
Ụdị ígwè: Aluminom base
Ọnụọgụ nke akwa akwa: 1
Elu:ENIG
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8.0W / mk elu thermal conductivity MCPCB maka ọkụ eletrik
Ụdị ígwè: Aluminom base
Ọnụọgụ nke akwa akwa: 1
Elu: HaSL efu efu
Ọkpụrụkpụ efere: 1.5mm
ọkpụrụkpụ ọla kọpa: 35um
Nrụpụta okpomọkụ: 8W/mk
Nguzogide okpomọkụ: 0.015 ℃ / W
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FPC dị mkpa polyimide bendable nwere FR4 stiffener
Ụdị ihe: polyimide
Ọnụọgụ oyi akwa: 2
Obosara / oghere: 4 mil
Nha oghere min: 0.20mm
Ọkpụrụkpụ osisi emechara: 0.30mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: uhie
Ogologo oge: 10 ụbọchị
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6 oyi akwa impedance akara isiike-flex bọọdụ nwere stiffener
Ụdị ihe: FR-4, polyimide
Obosara / oghere: 4 mil
Obere oghere: 0.15mm
Ọkpụrụkpụ osisi emechara: 1.6mm
ọkpụrụkpụ FPC: 0.25mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: uhie
Ogologo oge: 20 ụbọchị
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Resin plugging oghere Microvia immersion silver HDI nwere mkpọpu laser
Ụdị ihe: FR4
Ọnụọgụ oyi akwa: 4
Obosara / oghere: 4 mil
Nha oghere min: 0.10mm
Ọkpụrụkpụ osisi emechara: 1.60mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: acha anụnụ anụnụ
Ogologo oge: 15 ụbọchị
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3 oz solder mask plugging ENEPIG bọọdụ ọla kọpa dị arọ
A na-eji PCB ọla kọpa dị arọ na-arụ ọrụ na ngwa eletrọnịkị na sistemu ike na-enye ike ebe enwere nnukwu ihe achọrọ ugbu a ma ọ bụ ohere nke ịgbapụ ngwa ngwa nke mmejọ ugbu a.Ibu ọla kọpa na-abawanye nwere ike gbanwee bọọdụ PCB na-adịghị ike ka ọ bụrụ ebe siri ike, ntụkwasị obi, yana ikpo okwu wiring na-adịte aka ma na-agbagha mkpa maka akụrụngwa agbakwunyere ọnụ na nnukwu ihe dị ka Heat sinks, fan, wdg.
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ngwa ngwa multilayer High Tg Board nwere ọla edo imikpu maka modem
Ụdị ihe: FR4 Tg170
Ọnụọgụ oyi akwa: 4
Obosara / oghere: 6 mil
Nha oghere min: 0.30mm
Ọkpụrụkpụ osisi emechara: 2.0mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: akwụkwọ ndụ akwụkwọ ndụ"
Ogologo oge: 12 ụbọchị
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otu akụkụ imikpu ọla edo seramiiki dabere
Ụdị ihe: seramiiki base
Ọnụọgụ oyi akwa: 1
Obosara / oghere: 6 mil
Nha oghere min: 1.6mm
Ọkpụrụkpụ osisi emechara: 1.00mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: acha anụnụ anụnụ
Ogologo oge: 13 ụbọchị
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Mgbakọ PCB SMT ahụike dị ala
SMT bụ mkpirisi maka teknụzụ dị n'elu, teknụzụ na usoro kachasị ewu ewu na ụlọ ọrụ mgbakọ eletrọnịkị.Eletrọnịkị sekit Surface Mount Technology (SMT) ka a na-akpọ Surface Mount ma ọ bụ Surface Mount Technology.Ọ bụ ụdị nkà na ụzụ mgbakọ sekit nke na-etinye ihe ndị na-enweghị isi ma ọ bụ mkpụmkpụ ndu elu mgbakọ (SMC/SMD na Chinese) n'elu nke e biri ebi Circuit Board (PCB) ma ọ bụ ihe ndị ọzọ dị n'elu, wee welds na kpọkọta site na reflow ịgbado ọkụ ma ọ bụ. itinye ịgbado ọkụ.
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ngwa ngwa ntụgharị ihe atụ gold plating PCB nwere Counter sink oghere
Ụdị ihe: FR4
Ọnụọgụ oyi akwa: 4
Obosara / oghere: 6 mil
Nha oghere min: 0.30mm
Ọkpụrụkpụ osisi agwụla: 1.20mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
Emecha: ENIG
Agba nkpuchi solder: green"
Ogologo oge: 3-4 ụbọchị
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1.6mm ngwa ngwa prototype ọkọlọtọ FR4 PCB
Ụdị ihe: FR-4
Ọnụọgụ oyi akwa: 2
Obosara / oghere: 6 mil
Obere oghere: 0.40mm
Ọkpụrụkpụ osisi emechara: 1.2mm
Ọkpụrụkpụ ọla kọpa emechara: 35um
N'ikpeazụ: duru HASL efu
Agba nkpuchi solder: akwụkwọ ndụ akwụkwọ ndụ
Ogologo oge: 8 ụbọchị
