Mpi PCB Manufacturer

  • quick turn prototype gold plating PCB with Counter sink hole

    ngwa-atụ n'aka prototype gold plating PCB na Counter sink onu

    Typedị ihe: FR4

    Layer gụọ: 4

    Min trace obosara / ohere: 6 mil

    Min oghere size: 0.30mm

    Emechara mbadamba osisi: 1.20mm

    Emechara ọla kọpa: 35um

    Mechaa: ENIG

    Solder nkpuchi agba: green “

    Ebute oge: 3-4 ụbọchị

  • Low Volume medical PCB SMT Assembly

    PC obere SMT Assembly dị ala

    SMT bụ ndebiri nke Igwe Igwe Elu Elu, Teknụzụ kachasị ewu ewu na usoro na ụlọ ọrụ mgbakọ kọmputa. A na-akpọ Igwe Igwe Igwe Igwe Igwe Igwe Igwe (SMT) Mkpa Igwe ma ọ bụ Igwe Igwe Mkpa. Ọ bụ ụdị teknụzụ mgbakọ sekit nke na-etinye ihe ndị na-enweghị isi ma ọ bụ dị mkpụmkpụ (SMC / SMD na Chinese) n'elu nke Ebipụtara Circuit Board (PCB) ma ọ bụ ihe ndị ọzọ dị na mbara ala, wee welds na mgbakọ site na ịgbanye ọkụ ma ọ bụ itinye ịgbado ọkụ.

  • single sided immersion gold Ceramic based Board

    otu aka nke imikpu ọla edo dabere na Board

    Ihe ụdị: seramiiki isi

    Layer gụọ: 1

    Min trace obosara / ohere: 6 mil

    Min oghere size: 1.6mm

    Emechara mbadamba osisi: 1.00mm

    Emechara ọla kọpa: 35um

    Mechaa: ENIG

    Solder nkpuchi agba: acha anụnụ anụnụ

    Etiti oge: 13 ụbọchị

  • fast multilayer High Tg Board with immersion gold for modem

    ngwa ngwa multilayer High Tg Board na immersion gold maka modem

    Typedị ihe: FR4 Tg170

    Layer gụọ: 4

    Min trace obosara / ohere: 6 mil

    Min oghere size: 0.30mm

    Emechara mbadamba osisi: 2.0mm

    Emechara ọla kọpa: 35um

    Mechaa: ENIG

    Solder nkpuchi agba: green “

    Ebute oge: ụbọchị iri na abụọ

  • 1.6mm fast prototype standard FR4 PCB

    1.6mm ngwa ngwa prototype ọkọlọtọ FR4 PCB

    Typedị ihe: FR-4

    Layer gụọ: 2

    Min trace obosara / ohere: 6 mil

    Min oghere nha: 0.40mm

    Emechara mbadamba osisi: 1.2mm

    Emechara ọla kọpa: 35um

    Mechaa: na-eduga HASL n'efu

    Solder nkpuchi agba: akwụkwọ ndụ akwụkwọ ndụ

    Etiti oge: 8 ụbọchị

  • Resin plugging hole Microvia Immersion silver HDI with laser drilling

    Resin ịkwụnye oghere Microvia Imikpu ọlaọcha HDI na laser egwu

    Typedị ihe: FR4

    Layer gụọ: 4

    Min trace obosara / ohere: 4 mil

    Min oghere size: 0.10mm

    Emechara mbadamba osisi: 1.60mm

    Emechara ọla kọpa: 35um

    Mechaa: ENIG

    Solder nkpuchi agba: acha anụnụ anụnụ

    Etiti oge: 15 ụbọchị

  • 6 layer impedance control rigid-flex board with stiffener

    6 oyi akwa impedance akara isiike-Flex osisi na stiffener

    Typedị ihe: FR-4, polyimide

    Min trace obosara / ohere: 4 mil

    Min oghere size: 0.15mm

    Emechara mbadamba osisi: 1.6mm

    FPC ọkpụrụkpụ: 0.25mm

    Emechara ọla kọpa: 35um

    Mechaa: ENIG

    Solder nkpuchi agba: uhie

    Ebute ụzọ: ụbọchị iri abụọ

  • Thin Polyimide bendable FPC with FR4 stiffener

    Mkpa Polyimide gbagọrọ agbagọ FPC na FR4 stiffener

    Typedị ihe: polyimide

    Layer gụọ: 2

    Min trace obosara / ohere: 4 mil

    Min oghere nha: 0.20mm

    Emechara mbadamba osisi: 0.30mm

    Emechara ọla kọpa: 35um

    Mechaa: ENIG

    Solder nkpuchi agba: uhie

    Etiti oge: 10 ụbọchị

  • 3 oz solder mask plugging ENEPIG heavy copper board

    3 oz solder nkpuchi ịkwụnye ENEPIG arọ ọla kọpa

    A na-ejikarị PCB ọla kọpa dị egwu na sistemụ Ike Eletrọniki na Power Tụkwasịnụ ebe enwere nnukwu ihe dị ugbu a ma ọ bụ ohere ịme ngwa ngwa ịgbapụ ugbu a. Nnukwu ọla kọpa nwere ike ime ka ụlọ PCB na-adịghị ike ghọọ ikpo okwu siri ike, nke a pụrụ ịdabere na ya, nke na-adịte aka ma na-egbochi mkpa maka mgbakwunye na ihe ọkụkụ dị ka Heat sink, fans, etc.

  • 8.0W/m.k high thermal conductivity MCPCB for Electric torch

    8.0W / mk akwa thermal conductivity MCPCB maka ọwa eletriki

    Metdị ọla: Isi aluminom

    Number nke n'ígwé: 1

    Elu: Nweta free HASL

    Efere efere: 1.5mm

    Ọla kọpa: 35um

    Omume Igwe Igwe: 8W / mk

    Kwesiri nguzogide: 0.015 ℃ / W